Silicon ≥99.999% (metals basis), sputtering target, Ø 50.8 mm (2.0 in), Thickness: 3.18 mm (0.125 in)
Supplier: Thermo Scientific
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40890.KSEA
259
GBP
40890.KS
Silicon ≥99.999% (metals basis), sputtering target, Ø 50.8 mm (2.0 in), Thickness: 3.18 mm (0.125 in)
Silicon
Magnetron sputtering source
Formula:
Si MW: 28.09 g/mol Boiling Pt: 2355 °C (1013 hPa) Melting Pt: 1410 °C Density: 2.34 g/cm³ (20 °C) Storage Temperature: Ambient |
MDL Number:
MFCD00085311 CAS Number: 7440-21-3 EINECS: 231-130-8 Merck Index: 12,08635 |
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